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JITF 2025 - Presentation on SCAP technology

At JITF 2025, SITECH delivered a special technical presentation on SCAP technology, explaining its self-curing reaction mechanism, compatibility with various printhead platforms, and future market potential. The session was fully packed, sparking lively discussions and attracting strong interest from inkjet equipment manufacturers, material suppliers, and brand owners.


SCAP, UV INKJET INK, TAIWAN

During the presentation, the R&D team demonstrated SCAP’s printing performance on tissue paper. Even on such a highly absorbent substrate, the ink rapidly self-cured into a uniform film, achieving “no strike-through and no bleeding.” This simple yet highly convincing demonstration left a deep impression on attendees regarding SCAP’s chemical design and practical applicability.



In addition to showcasing SCAP’s well-established performance on piezo printheads, SITECH also unveiled—for the first time—its thermal inkjet (TIJ) self-curing printing results. On primer-coated PET media, SCAP successfully self-cured at room temperature without any heating, highlighting its strong material adaptability and equipment compatibility.



Beyond the water-based series, SITECH also presented the latest UV ink applications on non-absorbent substrates such as metal and glass, including:

  • High adhesion

  • Excellent scratch resistance after curing


These results further demonstrate the company’s expanding capabilities in multi-material and cross-industry inkjet applications.


For more information, feel free to leave a message or contact us. We look forward to connecting with you!

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